Study on Microstructure Control and Performance Optimization of Cu-15Ni-8Sn Alloy

Abstract

Copper alloys have high strength, high hardness, high elasticity, low processing cost, and are non-toxic and environmentally friendly. They are widely used in fields such as aerospace, navigation ships, electronic appliances, and communication engineering.Cu Ni Sn alloy is a typical Spinodal type alloy, which can achieve strengthening effect by precipitating ordered phases through amplitude modulation decomposition. It can be used as conductive contact springs in relays, potentiometers, switches, and elastic sensitive components in precision instrument sensors.At present, the main preparation technologies for this type of copper alloy include vacuum casting technology, rapid cooling solidification technology, mechanical alloying method (MA method), and powder metallurgy method.However, due to the tendency of discontinuous cellular precipitates to precipitate at grain boundaries during the amplitude modulation decomposition process, the strength and plasticity of the alloy decrease, and the alloy performance deteriorates. Therefore, certain measures need to be taken to suppress the precipitation of discontinuous precipitates.Therefore, the systematic study of the microstructure.